錢乙余

1955-1960年：畢業於哈爾濱工業大學焊接專業獲學士學位

1985-1989年：哈爾濱工業大學金屬材料及工藝系副教授

1989-目前：哈爾濱工業大學金屬材料及工藝系教授

1985-目前：哈爾濱工業大學材料加工工程學科碩士生導師

1993-目前：哈爾濱工業大學材料加工工程學科博士生導師

中國電子學會生產技術學會 副理事長

中國焊接學會 常務理事

中國焊接學會釺焊專業委員會 主 任

中國焊接標準化技術委員會釺焊分委員會 主 任

美國焊接學會（AWS）成 員

曾兼任哈爾濱市人大常委會常委

南崗區人大常委會副主任

現兼任全國政協第九界委員會委員

哈爾濱市政協副主席

材料加工工程

[1]H. Zhao, H. Wang, D. Sekulic, Y. Qian, Spreading kinetics of liquid solders over an intermetallic solid surface. Part 1: Eutectic lead solder, Journal of Electronic Materials, 38 (2009) 1838-1845.

[2]H. Wang, X. Ma, F. Gao, Y. Qian, Sn concentration on the reactive wetting of high-Pb solder on Cu substrate, Materials Chemistry and Physics, 99 (2006) 202-205.

[3]F. Wang, X. Ma, Y. Qian, Improvement of microstructure and interface structure of eutectic Sn-0.7Cu solder with small amount of Zn addition, Scripta Materialia, 53 (2005) 699-702.

[4]D. Sekulic, F. Gao, H. Zhao, B. Zellmer, Y. Qian, Prediction of the Fillet Mass and Topology of Aluminum Brazed Joints, Welding Journal, 83 (2004) 102S-110S.

[5]X. Ma, F. Wang, Y. Qian, F. Yoshida, Development of Cu-Sn intermetallic compound at Pb-free solder/Cu joint interface, Materials Letters, 57 (2003) 3361-3365.

[6]Y. Qian, X. Ma, F. Yoshida, The stress field characteristics in the surface mount solder joints under temperature cycling: Temperature effect and its evaluation, Welding Journal, 81 (2002) 85/S-89/S.

[7]X. Ma, Y. Qian, F. Yoshida, Effect of La on the Cu-Sn intermetallic compound (IMC) growth and solder joint reliability, Journal of Alloys and Compounds, 334 (2002) 224-227.

[8]H. Liu, J. Feng, Y. Qian, Interface structure and formation mechanism of diffusion-bonded joints of SiC ceramic to TiAl-based alloy, Scripta Materialia, 43 (2000) 49-53.