劉志權

部　門

通訊地址 遼寧省瀋陽市瀋河區文化路72號，中國科學院金屬研究所，環境功能材料研究部

1989年9月-1993年7月, 吉林工業大學，金屬材料科學與工程系，工學學士；

1993年9月-1996年7月, 大連鐵道學院，材料科學與工程系，工學碩士；

1996年9月-2000年4月, 大連海事大學，材料工藝研究所，工學博士。

1996年7月-2000年7月, 大連鐵道學院，材料科學與工程系，助教、講師；

2000年9月-2002年6月, 日本岡山理科大學(OUS, Japan)，工學部，博士后；

2002年7月-2007年3月, 日本國立物質材料研究機構(NIMS, Japan)，特別研究員。

2006年12月-現今, 中國科學院金屬研究所，研究員

長期從事與性能相關的材料結構及功能的顯微組織表徵和原位製備研究，目前研究重點為微電子互連材料和結構的組織性能及服役可靠性。主要針對微電子材料及其互連界面和結構，進行材料微觀結構與性能演化方面的應用基礎研究。包括材料和界面結構的靜態表徵，以及在熱，電，力作用下化合物轉變和缺陷演化的動態過程，以從微觀角度探討材料和界面失效的相關機理，為提高微電子材料性能和互連界面可靠性提供理論依據和解決途徑。

中國電子學會電子製造與封裝技術分會理事，遼寧半導體裝備產業技術創新戰略聯盟理事。

美國顯微學會2012年度創新獎，2012年

(1) X.W. Xie, Y. Li, Z.Q. Liu, M. Haruta, W.J. Shen, Low-temperature oxidation of CO catalyzed by Co3O4 nanorods, Nature, April

(2) H.H. Liu, S. Schmidt, H.F. Poulsen, A. Godfrey, Z.Q. Liu, J. Sharon, X. Huang, Three-dimensional orientation mapping in the transmission electron microscopy, Science

(3) Z.Q. Liu, P.J. Shang, D.X. Li, Microstructural study on Kirkendall voids formation in Sn-containing/Cu solder joints during solid-state aging, Microsc. Microanal., August

(4) P.J. Shang, L. Zhang, Z.Q. Liu, J. Tan, J.K. Shang, Ex-situ observations of fast intermetallic growth on the surface of interfacial region between eutectic SnBi solder and Cu substrate during solid-state aging process, Microelectron. Reliab., June

(5) C.F. Li, Z.Q. Liu, Fabrication of nanocrystalline SnO2 using electron stimulated oxidation, Nanotechnology, May

(6) C.F. Li, Z.Q. Liu, Microstructure and growth mechanism of tin whisker on RESn3 compounds, Acta Mater., January

(7) C.F. Li, Z.Q. Liu, J.K. Shang, The effects of temperature and humidity on the growth of tin whisker and hillock from Sn5Nd alloy, J. Alloy. Compd., February

(8) Z.G. Shang, Z.Q. Liu, P.J. Shang, J.K. Shang, Synthesis of single-crystal TiO2 nanowire using titanium monoxide powder by thermal evaporation, J. Mater. Sci. Technol., May

(9) H. Zhang, D. Wu, L. Zhang, Z.Z. Duan, C.M. Lai, Z.Q. Liu, Wafer level electrodeposition of Fe-Ni novel UBM films, Acta Metall. Sin., October

(10) Z.G. Shang, Z.Q. Liu, Q. Li, Z.J. Wang, J.K. Shang, Characterization and visible light germicidal efficacy of nitrogen doped TiO2 film crystallized by microwave irradiations, Thin Solid Films, January

(11) Y.X. Chen, L. Zhang, L.H. He, Y.D. He, P.J. Shang, Z.Q. Liu, H.B. Liu,Monocrystalline porous iron oxide particles with tunable size for lithium-ion batteries, Mater. Lett., February

(12) C.F. Li, Z.Q. Liu, P.J. Shang, J.K. Shang, In situ investigation on the oxidation behavior of a RESn3 film by transmission electron microscopy, Scripta Mater., December

(13) X.Y. Pang, Z.Q. Liu, S.Q. Wang, J.K. Shang, Effects of Bi segregation on the tensile properties of Cu/Cu3Sn(100) interface, Microelectron. Reliab., December

(14) P.J. Shang, Z.Q. Liu, D.X. Li, J.K. Shang, Intermetallic compound identification and Kirkendall void formation in eutectic SnIn/Cu solder joint during solid-state aging, Phil. Mag. Lett., June

(15) Y.X. Chen, L.H. He, P.J. Shang, Q.L. Tang, Z.Q. Liu, H.B. Liu, L.P. Zhou, J.H. Chen, Micro-sized and nano-sized Fe3O4 particles as anode materials for lithium-ion batteries, J. Mater. Sci. Technol., January

(16) Fabrication of metal-oxide-diamond field-effect transistors with submicron-sized gate length on boron-doped (111) H-terminated surfaces using electron beam evaporated SiO2 and Al2O3, J. Electron. Mater., March

(17) J.Y. Liu, M.J. Jin, C. Ni, Y. Shen, G.L. Fan, Z. Wang, Y.F. Zhang, C.F. Li, Z.Q. Liu, X.J. Jin, Strain glassy behavior and premartensitic transition in Au7Cu5Al4 alloy, Phys. Rev. B, October

(18) C.F. Yao, C.F. Li, Z.Q. Liu, J.K. Shang, Structural ordering and magnetic property of complex perovskite solid solution (1-x)Pb(Fe2/3W1/3)O3–xPb(Mg1/2W1/2)O3, J. Inorg. Mater., June

(19) X.W. Xie, P.J. Shang, Z.Q. Liu, Y.G. Lv, Y. Li, W.J. Shen, Synthesis of nanorod-shaped cobalt hydroxycarbonate and oxide with the mediation of ethylene glycol, J. Phys. Chem. C, 13 January

(20) Q. Li, Y.W. Li, Z.Q. Liu, R.C. Xie, J.K. Shang, Memory antibacterial effect from photoelectron transfer between nanoparticles and visible light photocatalyst, J. Mater. Chem., 14 February

(21) S.P. Lu, S.T. Wei, Z.Q. Liu, D.Z. Li, Y.Y. Li, Effects of normalizing process on the microstructural evolution and mechanical properties of low carbon steel weld metal with niobium addition, ISIJ Int.

(22) X.Y. Pang, P.J. Shang, S.Q. Wang, Z.Q. Liu, J.K. Shang, Weakening of the Cu/Cu3Sn(100) interface by Bi impurities, J. Electron. Mater., 7 April

(23) C.F. Yao, Z.Q. Liu, J.K. Shang, A promising sol-gel route to suppress pyrochlore phase during the synthesis of multiferroic Pb(Fe2/3W1/3)O3 using inorganic salts, J. Alloy. Compd., 23 July

徠(24) P.J. Shang, Z.Q. Liu, D.X. Li, J.K. Shang, Crack propagation of single crystal b-Sn during in-situ TEM straining, J. Electron Microsc., August

(25) X.Y. Pang, Z.Q. Liu, S.Q. Wang, J.K. Shang, First-principles investigation of Bi segregation at the solder interface of Cu/Cu3Sn(010), J. Mater. Sci. Technol., December

(26) P.J. Shang, Z.Q. Liu, X.Y. Pang, D.X. Li, J.K. Shang, Growth mechanisms of Cu3Sn on polycrystalline and single crystalline Cu substrates, Acta Mater., Sept.

(27) P.J. Shang, Z.Q. Liu, D.X. Li, J.K. Shang, TEM observations of the growth of intermetallic compounds at the SnBi/Cu interface, J. Electron. Mater., De

(28) John P. Daghfal, P.J. Shang, Z.Q. Liu, J.K. Shang, Interfacial reactions between In-Sn solder and Ni-Fe platings, J. Electron. Mater., Dec

(29) Q.L. Yang, P.J. Shang, J.D. Guo, Z.Q. Liu, J.K. Shang, Current-induced growth of P-rich phase at electroless Nickel/Sn interface, J. Mater. Res., Sept

(30) W. Zhang, Z.Q. Liu, K. Furuya, Fabrication, characterization, and application of cellular iron nanocrystalline film, Nanotechnology

(31) P.J. Shang, Z.Q. Liu, D.X. Li, J.K. Shang, Bi-induced voids at the Cu3Sn/Cu interface in eutectic SnBi/Cu solder joints, Scripta Mater.

(32) P.J. Shang, Z.Q. Liu, D.X. Li, J.K. Shang, Directional growth of Cu3Sn at the reactive interface between eutectic SnBi solder and (100) single crystal Cu, Scripta Mater

(33) X.Y. Pang, S.Q. Wang, L. Zhang, Z.Q. Liu, J.K. Shang, First principles calculation of elastic and lattice constants of orthorhombic Cu3Sn crystal, J. Alloys Compd.

(1) Z.Q. Liu, H. Zhang, L. Zhang, H.Y. Guo, C.M. Lai, Phase evolution at the interface of SnAgCu/FeNi solder joint during solid state aging, 2013 International Conference on Electronic Packaging Technology (ICEPT2013), August

(2) Z.Q. Liu, F.F. Tian, P.J. Shang, Interfacial reaction of low-melting point lead-free solder joints during thermal aging, The International Symposium on Visualization in Joining & Welding Science through Advanced Measurements and Simulation (Visual-JW2012), November 2012, Osaka, Japan

(3) Z.Q. Liu, P.J. Shang, D.X. Li, Microstructural study on Kirkendall voids formation in Sn-containing/Cu solder joints during solid-state aging, 5th Congress of the International Union of Microbeam Analysis Societies (IUMAS-V)

(1) 劉志權，古屋一夫，長谷川明，三石和貴，橋本初次郎，一種利用電子束製備鐵氧化物的方法，日本發明專利，授權日期2008年2月29日。

(2) 劉志權，姚春發，李財富，製備鈣鈦礦結構鉛基弛豫陶瓷或其固溶體的濕化學方法，中國發明專利，申請日期2010年6月12日。

(3) 劉志權，李財富，納米晶粒二氧化錫的電子束製備方法。中國發明專利，申請日期2011年3月4日。

(4) 劉志權，尚振崗，尚攀舉，二氧化鈦納米材料的固相製備方法，中國發明專利，申請日期2011年3月4日。

(5) 劉志權，田飛飛，李財富，曹麗華，一種微互連通孔結構透射電鏡樣品的製備方法，中國發明專利，申請日期2013年3月29日。

(6) 祝清省，劉志權，郭敬東，張磊，曹麗華，一種基於化學鍍鎳合金的通孔填充方法及其應用，中國發明專利，申請日期2012年12月25日。

(7) 郭敬東，祝清省，劉志權，崔學順，吳迪，張磊，曹麗華，一種力電熱多場耦合下微電子產品可靠性測試方法，中國發明專利，申請日期2012年12月21日。

(8) 崔學順，郭敬東，祝清省，劉志權，吳迪，張磊，曹麗華，力電熱多場耦合作用下微電子產品可靠性測試平台，中國發明專利，申請日期2012年12月21日。

(9) 崔學順，郭敬東，祝清省，劉志權，吳迪，張磊，曹麗華，微電子產品多場服役特性測試儀，中國實用新型專利，授權日期2013年4月18日。